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中文
Research Progress on Damage and Hot Spots in PBX under Complex Loading: Mechanisms, Experiments, and Characterization
WU Lei, QU Kepeng, TAN Miao, YAO Xin
Packaging Engineering . 2026, (
9
): 1 -13 . DOI: 10.19554/j.cnki.1001-3563.2026.09.001
