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中文
Design and Simulation Analysis of Vibration and Sound Radiation Characteristics of Irregular Grid Packaging Boards
TAN Weichao, LIU Zigui, PAN Zhixuan, LAI Xinyu
Packaging Engineering . 2026, (
7
): 300 -306 . DOI: 10.19554/j.cnki.1001-3563.2026.07.034
