Design and Simulation Analysis of Vibration and Sound Radiation Characteristics of Irregular Grid Packaging Boards

TAN Weichao; LIU Zigui; PAN Zhixuan; LAI Xinyu

doi:10.19554/j.cnki.1001-3563.2026.07.034

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Packaging Engineering ›› 2026, Vol. 47 ›› Issue (7) : 300-306. DOI: 10.19554/j.cnki.1001-3563.2026.07.034

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Design and Simulation Analysis of Vibration and Sound Radiation Characteristics of Irregular Grid Packaging Boards

TAN Weichao, LIU Zigui, PAN Zhixuan, LAI Xinyu

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Abstract

The work aims to investigate the differences in vibration and sound radiation performance among different types of irregular grid packaging boards, to pioneer new design pathways for material reduction and noise reduction technologies in packaging board structures. An aluminum alloy packaging board with circular holes was selected as the research object to establish a board structure model. The structural dynamic analysis was conducted based on diverse hole diameter arrangement schemes. The finite element method (FEM) was employed to analyze the dynamic characteristics and sound radiation performance of the irregular grid packaging boards, and the modal superposition method was used to compare vibration transmission results and sound radiation level outcomes. The natural frequency of the structure showed a decreasing trend with the increasing hole diameter. The large-hole grid packaging board exhibited excellent overall Equivalent Radiated Sound Pressure Level (ERPL). The sound radiation characteristics of the grid board with an outward-inward gradient hole diameter design were similar to the dynamic characteristics of the large-hole board. Among them, vibration transmission and sound radiation levels followed the same trend as the dynamic response within the structural resonance frequency band. This type of grid packaging board mainly exhibits vertical upward vibration modes under vertical base excitation, and also maintains good stability in vibration transmission under excitation in other directions. The finite element method reveals the evolution law of sound radiation distribution of such board structures, providing a reference for the design and optimization of vibration and noise reduction in similar board structures.

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irregular grid packaging board / sound radiation characteristics / layout optimization analysis

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TAN Weichao, LIU Zigui, PAN Zhixuan, LAI Xinyu. Design and Simulation Analysis of Vibration and Sound Radiation Characteristics of Irregular Grid Packaging Boards[J]. Packaging Engineering. 2026, 47(7): 300-306 https://doi.org/10.19554/j.cnki.1001-3563.2026.07.034

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