电子封装用Sn‒Ag‒Cu低银无铅钎料研究进展及发展趋势

卢晓, 张亮, 王曦, 李木兰

Research Progress and Prospect of Low-Ag Lead-free Sn-Ag-Cu Solder in Electronic Packaging

LU Xiao, ZHANG Liang, WANG Xi, LI Mu-lan

. 2022, (23): 118 -136 . DOI: 10.19554/j.cnki.1001-3563.2022.23.015