目的 为了适应高银钎料向低银钎料转变的发展趋势，综述近年来对低银SnAgCu钎料的最新研究，展示其在电子封装材料领域中宽广的应用前景。方法 通过分析国内外有关低银钎料的研究成果，详细介绍合金化和颗粒强化等方法对低银钎料熔化特性、润湿性、显微结构、界面组织、力学性能的影响，重点总结元素掺杂的最佳添加量以及改性机理。结论 通过添加金属元素、稀土元素、纳米颗粒，采用新型搅拌技术能有效提升钎料性能，部分改性后的低银复合钎料性能达到了高银钎料性能水平。

The work aims to review the latest research on low-Ag Sn-Ag-Cu solder in recent years to demonstrate its broad application prospects in the field of electronic packaging materials, so as to meet the development trend of high-Ag solder to low-Ag solder. Through the analysis on the research results of low-Ag solder at home and abroad, the effects of alloying and particle strengthening on the melting characteristics, wettability, microstructure, interface structure and mechanical properties of low-Ag solder were introduced in detail. The optimum addition amount of element doping and the modification mechanism were summarized. As a result, by adding metal elements, rare earth elements and nanoparticles, the new stirring technology can effectively improve the properties of the solder. The properties of partially modified low-Ag composite solder reach the level of high-Ag solder.