目的 随着微电子封装技术向小型化、高密度、高可靠及低功耗方向演进,叠层封装器件面临着严峻的散热挑战、异质异构界面应力集中,以及湿热环境下的失效风险。为此,亟须从理论层面深入探究湿热环境下复杂应力对叠层封装器件的作用机制,以突破其湿热应力失效的技术瓶颈。方法 本研究采用分布式有限元仿真技术,基于菲克（Fick）扩散定律构建湿气扩散模型并引入相对湿度场变量,以解决多材料界面处湿气浓度不连续的求解难题。在此基础上,建立热-湿-力多物理场耦合模型,系统揭示超薄叠层封装结构参数影响湿热环境下复杂应力分布与演化规律。结果 芯片黏接层与模塑料交界处湿气浓度梯度大,封装内部湿气浓度分布不均导致湿热应力集中,最大值位于底层芯片底角（287.6 MPa）,双层叠层封装中湿应力与热应力比值约为1∶2.76,超薄叠层封装中该比值约为1∶3.95。对于不同顶层芯片面积形状的封装结构,最大湿热应力差值达到了75.2 MPa。同时,基板厚度对封装湿热可靠性存在显著影响,将基板厚度从0.3 mm优化至0.1 mm时,最大湿热机械应力降低了28.89%。结论 本论文揭示了湿气扩散与湿热耦合应力对3D叠层封装器件失效的影响机制,阐明了关键结构参数与可靠性之间的内在联系,为解决3D叠层封装在湿热环境下的失效问题提供了坚实的理论依据,对提升高密度微系统封装的长期可靠性具有重要的科学价值与工程指导意义。
Abstract
With the development of microelectronic packaging technology towards miniaturization, high density, high reliability, and low power consumption, stacked packaging devices are confronted with severe heat dissipation challenges, stress concentration at heterogeneous interfaces, and failure risks in damp and hot environments. Therefore, it is urgent to deeply investigate the mechanism of complex stress on stacked packaging devices under damp and hot environments from a theoretical perspective, so as to break the technical bottleneck of failure. Through distributed finite element simulation techniques, based on Fick's diffusion law, a moisture diffusion model was constructed. The relative humidity field variable was introduced to handle the discontinuity of moisture concentration in multi-material systems, and a damp-hot-mechanical stress model was established to systematically investigate how structural parameters of ultra thin stacked package affected the distribution and evolution of complex stress associated with damp and hot reliability. There was a large gradient of moisture concentration at the interface between the chip bonding layer and the molding compound, and the uneven distribution of moisture concentration inside the package led to the concentration of damp and hot stress. The maximum value was located at the bottom corner of the bottom chip (287.6 MPa). The ratio of damp stress to thermal stress in the double-layer stacked package was about 1∶2.76, and in the ultra thin stacked package, the ratio was about 1∶3.95. For packages with different top chip area shapes, the maximum difference in damp and hot stress reached 75.2 MPa. Meanwhile, the substrate thickness exerted a significant effect on the damp and hot reliability of the package. When the substrate thickness was optimized from 0.3 mm to 0.1 mm, the maximum damp and hot mechanical stress decreased by 28.89%. This work reveals the effect mechanism of moisture diffusion and damp and hot mechanical stress on the failure of stacked packaging devices, providing a theoretical basis for solving the reliability problem of stacked package in damp and hot environments, and is of great significance for improving the reliability of stacked package.
关键词
叠层封装 /
湿热可靠性 /
湿气扩散 /
湿热机械应力 /
有限元分析
Key words
stacked package /
damp and hot reliability /
moisture diffusion /
damp and hot mechanical stress /
finite element analysis
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基金
国家自然科学基金（U2441249）; 广西科技计划项目（桂科FN2600640262）; 贵州省科技项目（黔科合支撑[2024]一般187）; 贵州省教育厅青年科技人才成长项目（黔教技[2024]295号）
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