目的 为解决大豆蛋白胶黏剂耐水性差、强度不足,难以满足实际应用需求的问题。方法 本文以微晶纤维素为原料,经高碘酸钠氧化制得双醛纤维素（DAC）,并将其作为反应型交联剂引入大豆蛋白（SPI）体系,用于制备三层杨木胶合板。通过调控热压温度、压力、时间及DAC添加量,系统考察其对胶合性能的影响,并结合红外光谱（FT-IR）、X射线电子能谱（XPS）、与扫描电镜（SEM）、光学显微镜（OM）以及接触角测试等多尺度表征手段,揭示其增强机制。结果 实验发现,在170 ℃、1.0 MPa下热压40 min,且DAC用量为SPI质量的50%时,湿态强度达到2.24 MPa,是Ⅱ类胶合板国家标准（0.7 MPa）的3倍以上,表现出优异的耐水性能。进一步分析表明,热压过程中DAC的醛基与SPI分子中的氨基发生了缩合反应,形成C-N共价键及新酰胺结构,构建出稳定的三维交联网络。结论 该工作为解决SPI胶黏剂耐水性差、强度不足的问题提供了一条切实可行的技术路径。
Abstract
The work aims to solve the problem that soy protein-based adhesives are limited in practical applications due to poor water resistance and insufficient bonding strength. Dialdehyde cellulose (DAC) was synthesized through periodate oxidation of microcrystalline cellulose and incorporated into soy protein isolate (SPI) system as a reactive crosslinker for fabricating poplar plywood. By systematically varying hot-pressing conditions (temperature, pressure, duration) and DAC loading levels, the effects of DAC on bonding performance was evaluated. A suite of characterization techniques, including FTIR, XPS, scanning electron microscopy (SEM), optical microscope (OM), and contact angle test were employed to probe the underlying enhancement mechanism. Under optimized conditions (170 °C, 1.0 MPa, 40 min) with 50 wt% DAC relative to SPI, the wet bonding strength reached 2.24 MPa, which was more than three times that of the national standard for Class Ⅱ plywood (0.7 MPa), demonstrating excellent water resistance. Further analysis showed that, during hot pressing, aldehyde groups on DAC reacted with amino groups in SPI to form C-N covalent linkages and new amide structures, thereby establishing a robust three-dimensional crosslinked network. The strategy presented here offers a practical route for solving the poor water resistance and insufficient strength of SPI adhesives.
关键词
胶黏剂 /
大豆蛋白 /
双醛纤维素 /
胶合板
Key words
adhesive /
soy protein /
dialdehyde cellulose /
plywood
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