Temperature Field Simulation and Structure Improvement of Wallpaper Packaging Machine Oven

WANG Yuan, WU Ji-mei, CHEN Yan

Packaging Engineering ›› 2017 ›› Issue (13) : 184-188.

Packaging Engineering ›› 2017 ›› Issue (13) : 184-188.

Temperature Field Simulation and Structure Improvement of Wallpaper Packaging Machine Oven

  • WANG Yuan1, WU Ji-mei2, CHEN Yan3
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Abstract

The work aims to analyze the uniformity of wallpaper packaging machine temperature field by using the finite element numerical simulation method, so as to improve the packaging quality. The temperature field of the working process was simulated and analyzed via FLUENT by creating 3D model for packaging machine oven. The structure was improved with respect to the influence factors in the analysis results. The distribution of temperature field in the wallpaper packaging machine oven was obtained and the factors that affected the uniformity of oven temperature field were found out. The uniformity of internal temperatures was intensified by improving the structure of wallpaper packaging machine oven. The oven temperature uniformity and packaging efficiency can be effectively improved by partly changing the structures of air inlet and outlet of the oven.

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WANG Yuan, WU Ji-mei, CHEN Yan. Temperature Field Simulation and Structure Improvement of Wallpaper Packaging Machine Oven[J]. Packaging Engineering. 2017(13): 184-188

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