Process and Curing Properties of RTM Resin System for Launch Box

XU Shu-quan, HUANG Li-guo, CAI Jian, QIN Xu-feng, BAI Tao, WANG Dao-quan

Packaging Engineering ›› 2016 ›› Issue (1) : 115-119.

Packaging Engineering ›› 2016 ›› Issue (1) : 115-119.

Process and Curing Properties of RTM Resin System for Launch Box

  • XU Shu-quan1, CAI Jian1, QIN Xu-feng1, BAI Tao1, WANG Dao-quan1, HUANG Li-guo2
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Abstract

The aim of this work was to study the viscosity and curing properties of epoxy resin system, in order to provide a theoretical basis for manufacturing launch box using RTM process. The dynamic viscosity and static viscosity of the E-51epoxy resin system were tested by rotational viscometer. The curing behavior of the resin system was studied using the non-isothermal DSC method and Flat knife method. The viscosity of the resin system was still less than 1000 mPa·s after 70 min at 60~80 ℃, which met the process requirements. And it was deduced that the curing temperature parameter was 60, 125 and 180 ℃ respectively, as well as the relationship equation of gel time and temperature. The temperature range 60~80 ℃ could be used as the operating range for RTM process to manufacture launch box. The recommended curing process of system was heat curing 3.5, 2 and 1 h at 60,90 and 125 ℃respectively, post-treatment process for the next 1h at 180 ℃.

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XU Shu-quan, HUANG Li-guo, CAI Jian, QIN Xu-feng, BAI Tao, WANG Dao-quan. Process and Curing Properties of RTM Resin System for Launch Box[J]. Packaging Engineering. 2016(1): 115-119

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