Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys

HUA Guang-jun, LIAO Ze-shun, XIE Yong, MO Can-liang

Packaging Engineering ›› 2016 ›› Issue (1) : 78-82.

Packaging Engineering ›› 2016 ›› Issue (1) : 78-82.

Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys

  • HUA Guang-jun1, LIAO Ze-shun1, XIE Yong1, MO Can-liang2
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Abstract

The distribution of surface temperature in heating plate of hot-pressed pulp molding mold is one of the main factors affecting the quality of the pulp molding products. In this paper, the channel structure of the original heating plate was optimized to obtain a more optimized scheme, with more uniform surface temperature distribution. During the experiment, Ansys software was used for temperature field simulation analysis, and the influence of the channel structure of heating plate on its surface temperature distribution was studied. The analysis result showed that the maximum range of temperature difference in the original heating plate surface could reach 11.6 ℃ , while the maximum range of surface temperature difference in the optimized heating plate was 2.2 ℃. After optimiation, the surface temperature difference was decreased by 81% compared with that of the original plate. The research provides a feasible optimization scheme for channel structure of the heating plate in pulp molding.

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HUA Guang-jun, LIAO Ze-shun, XIE Yong, MO Can-liang. Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys[J]. Packaging Engineering. 2016(1): 78-82

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