Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys
HUA Guang-jun, LIAO Ze-shun, XIE Yong, MO Can-liang
Packaging Engineering ›› 2016 ›› Issue (1) : 78-82.
Analysis and Optimization of Temperature Field in Pulp Molding Mold Heating Plate Based on Ansys
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