Viscosity and Curing Kinetics of Resin System for Wet Winding of Launch Box

BAO Rui, QIU Zhen-an, XU Shu-quan

Packaging Engineering ›› 2015 ›› Issue (17) : 139-143.

Packaging Engineering ›› 2015 ›› Issue (17) : 139-143.

Viscosity and Curing Kinetics of Resin System for Wet Winding of Launch Box

  • BAO Rui1, QIU Zhen-an1, XU Shu-quan2
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Abstract

In order to provide theoretical basis for wet winding of the launch box, the article studied the viscosity and curing kinetics of E-51 resin system modified by liquid epoxy resin. The static viscosity of resin system at 25 ℃, 30 ℃ and 35 ℃ was tested by rotational viscometer, the non-isothermal curing kinetics of resin system was studied by DTA, and the parameters of the curing process were derived by T-β extrapolation. The viscosity of the resin system at 25 ℃, 30 ℃ and 35℃ respectively was 1219 mPa·s, 1568 mPa·s and 1789 mPa·s after 8 h, respectively. The curing process parameters were Ti =71 ℃, Tp =131 ℃, Tf =181 ℃. The curing kinetics equation was obtained. The viscosity of resin system was less than 2 Pa·s, meeting the process requirement of wet winding of the launch box. The curing process was curing at constant temperatures of 70 ℃,100 ℃,130 ℃and 180 ℃ for 2 h, respectively.

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BAO Rui, QIU Zhen-an, XU Shu-quan. Viscosity and Curing Kinetics of Resin System for Wet Winding of Launch Box[J]. Packaging Engineering. 2015(17): 139-143

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