Vulnerability of Printed Circuit Board in Level Drop Impact

LIU Hong

Packaging Engineering ›› 2015 ›› Issue (17) : 84-86.

Packaging Engineering ›› 2015 ›› Issue (17) : 84-86.

Vulnerability of Printed Circuit Board in Level Drop Impact

  • LIU Hong
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Abstract

The aim of this work was to study the deflection response of printed circuit board under the standard impact load and the influence of different parameters on the brittle value of the circuit board. Considering the drop impact of the printed circuit board under the triangular pulse, the circuit board with four edges was simplified into a beam model. The impulse excitation was considered as the intrinsic displacement, and a model was built to solve the deflection and acceleration response of the circuit board, which were then compared with the features of the circuit board to evaluate the reliability of the circuit board. The maximum deflection and maximum acceleration of the plate both occurred near the middle of the plate, and in the middle of the moment when the plate was impacted by the triangular pulse. In conclusion, the theoretical basis for the reliability of the circuit board under the triangular pulse was provided.

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LIU Hong. Vulnerability of Printed Circuit Board in Level Drop Impact[J]. Packaging Engineering. 2015(17): 84-86

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