Thermal Analysis on the Bond Strength of the Soybean Adhesive Improved by Nanocrystalline Cellulose
LIU Cong, ZHANG Yang
Packaging Engineering ›› 2015 ›› Issue (13) : 15-19.
Thermal Analysis on the Bond Strength of the Soybean Adhesive Improved by Nanocrystalline Cellulose
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