Targeting at the problem of low efficiency of the indirect healing scheme of the thermal head of LED taping machine, solidworks was used for solid modeling, and thermal analysis as well as design optimization were conducted in Ansys, in order to propose a novel direct heating scheme. According to the basic requirements of SMD device taping packaging, the basic principle of thermal sealing packaging of LED taping machine was combined, the concept of finite element thermal analysis was introduced, and Ansys finite element analysis software was used to perform thermal analysis for the direct and indirect heating schemes. The result finally suggested that the scheme of thermal head direct heating was better than the indirect heating scheme, which had the advantages of fast warming, simple structure and small temperature difference. In conclusion, the scheme of thermal head direct heating was a feasible alternative, which provided theoretical basis for the implementation of specific design.