To investigate the mechanism of adhesive bonding between soy protein adhesive and cellulose, and to provide theoretical basis for further improvement of the adhesive properties of the soy protein adhesive. The physical and chemical properties of the soy protein adhesive were tested and analyzed. The soy protein-based adhesive and the cellulose were characterized using DSC and FTIR to examine the bonding mechanism. Endothermic reaction occurred for soy protein adhesive at about 150℃, resulting in decreased number of hydrophilic groups and increased number of amide bonds. During the curing process of the mixture of soy protein adhesive and cellulose, the endothermic reaction temperature decreased, and the enthalpy increased. The absorption of —COOH and C—OH decreased after curing. There was cross-linkage during the curing process of soy protein adhesive and cellulose, and polymers were formed during the endothermic reactions between soy protein adhesive and cellulose.