Objective To summarize the application of thermally conductive polymer materials in the field of electronic packaging. Methods Firstly, this article described two methods for preparing thermally conductive polymer materials, namely, structured polymer materials and particle-filled polymer materials; secondly, the development status of the two kinds of preparation methods at home and abroad were summarized, especially the particle-filled polymer materials. Results The particle-filled polymer materials had greater advantages over the other, such as simple processing, low cost, and suitable for most polymers, so it was the main research method for preparing thermally conductive polymer materials; the type, shape, size and surface treatment of fillers all had important influence on improving the thermal conductivity of polymer materials. Conclusion Improvement of the thermal conductivity of polymer matrix should fully consider the impact of various factors, while maintaining the stability of other properties, to meet the actual needs of industry and daily life.