Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge
WANG Fei, MU Jun, WANG Zuo-yu
Packaging Engineering ›› 2014 ›› Issue (17) : 43-47.
Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge
/
| 〈 |
|
〉 |