Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge

WANG Fei, MU Jun, WANG Zuo-yu

Packaging Engineering ›› 2014 ›› Issue (17) : 43-47.

Packaging Engineering ›› 2014 ›› Issue (17) : 43-47.

Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge

  • WANG Fei1, MU Jun1, WANG Zuo-yu2
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Abstract

Objective To simulate the 3D design of the corrugated box based on Solidedge, through offset of the bending line, the bending command based on the sheet metal environment was used as the demand of corrugated box folding from the slotted midline. Methods The problems existing in the bending process were brought up, a simplified 150 mm by 80 mm corrugated cardboard was analyzed for the effect of bending command on the molding process from the aspects of bending method, thickness of the plate and board size. The offset distance moved to the fixed end of the bending line was optimized. Results The bending mode of“Outside of the material” had the minimal impact on the bending command; with the increase of the plate thickness, the effect on bending command increased, and the initial offset distance was 0.25t; the size of plate had no effect on the bending command. Conclusion If the bending line offset to the fixed end was 0.26t-0.05, the bending problem from 2D to 3D molding may be solved.

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WANG Fei, MU Jun, WANG Zuo-yu. Simulation of Bending Problem in the 3D Molding of Corrugated Cardboard Based on SolidEdge[J]. Packaging Engineering. 2014(17): 43-47

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