Objective To study the effects of the RFID inlay packaging process on the quality of the label． Methods The effects of dispensing technology， crystal picking technology， hot pressing and curing technology in the dispensing process on the quality of the tag were discussed． The key study was the parameters of hot pressing and curing technology including hot-pressing stress, hot-pressing temperature and hot-pressing time． The hot-pressing stress was set at 3, 3.5, 4 MPa, the hot-pressing temperature was set at 160/150 ℃ , 170/160 ℃ , 170/160 ℃ , and the hot pressing time was set at 10, 12, 14 s. Orthogonal tests with three factors and three levels were used to optimize the tests. Results Under the normal conditions of resistance and RW, by measuring the shear strength, we found that different combinations of parameters led to different shear stress. Conclusion Through experimental contrast and analysis, the best thermal curing parameter combination was obtained: hot-pressing stress 3.5 MPa, hot-pressing temperature 180/170 ℃， hot pressing time 10 s.