Application of Machine Vision and Laser Cutting in Special-shaped Blister Packaging

WANG Wei-yi, ZHANG Qiu-ju

Packaging Engineering ›› 2013 ›› Issue (23) : 116-120.

Packaging Engineering ›› 2013 ›› Issue (23) : 116-120.

Application of Machine Vision and Laser Cutting in Special-shaped Blister Packaging

  • WANG Wei-yi, ZHANG Qiu-ju
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Abstract

To improve the degree of automation of plastic blister packaging production, and improve cutting process of special-shaped plastic blister packaging, a method was put forward, which introduces machine vision and laser cutting technology into plastic blister packaging production, and combines machine vision with laser cutting to cut the specialshaped plastic blister packaging. The method applies machine vision technology to get the cutting mode and the cutting path of special-shaped plastic blister packaging, generates the auxiliary connection path by intelligent algorithm assisted machining, and uses laser cutting technology to cut plastic blister packaging in order to realize the separation or trimming. The principle and application of the cutting method, and correlation algorithm of machine vision was introduced. This method has been applied to practice and works well.

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WANG Wei-yi, ZHANG Qiu-ju. Application of Machine Vision and Laser Cutting in Special-shaped Blister Packaging[J]. Packaging Engineering. 2013(23): 116-120

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