Temperature Field Simulation and Optimization Design of 96-hole Thin-film Heat-sealing Plate Based on SolidWorks

WEI Yin-wen, ZHU Lei, GAO Guan-hong

Packaging Engineering ›› 2013 ›› Issue (17) : 9-11.

Packaging Engineering ›› 2013 ›› Issue (17) : 9-11.

Temperature Field Simulation and Optimization Design of 96-hole Thin-film Heat-sealing Plate Based on SolidWorks

  • WEI Yin-wen1, ZHU Lei1, GAO Guan-hong2
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Abstract

In order to solve the problem of the 96-hole thin film heat-sealing plate's temperature field distribution in the field of biochemical analysis, SolidWorks 3D modeling software with its plug-ins Simulation was applied to analyze and design the heat plate. Simulation analysis was carried out on the existing thin-film heat sealing plate. The simulation data were verified with experiment. The results showed that simulation data coincide with experimental data, which prove that the idea and method is suitable for simulation to optimize such non-isothermal plate. The heating wire arrangement in the plate was adjusted according to the simulation, which reduce the maximum temperature difference on the surface of the hot plate within ±1 ℃.

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WEI Yin-wen, ZHU Lei, GAO Guan-hong. Temperature Field Simulation and Optimization Design of 96-hole Thin-film Heat-sealing Plate Based on SolidWorks[J]. Packaging Engineering. 2013(17): 9-11

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