Applied Research of Packaging Dynamics of Router Fan Assembly Packaging Based on ANSYS Workbench

QIN Lu, DING Yi, SU Jie

Packaging Engineering ›› 2013 ›› Issue (13) : 56-58.

Packaging Engineering ›› 2013 ›› Issue (13) : 56-58.

Applied Research of Packaging Dynamics of Router Fan Assembly Packaging Based on ANSYS Workbench

  • QIN Lu, DING Yi, SU Jie
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Abstract

Transport packaging of large router fan assembly was carried out. Applied research of packaging dynamics of large router fan assembly was made aiming at two working conditions of vibration and drop in transportation process. Simulation was carried out using ANSYS Workbench and the feasibility of the transport packaging was validated based on the simulation results. The purpose was to provide reference for transport packaging design of products.

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QIN Lu, DING Yi, SU Jie. Applied Research of Packaging Dynamics of Router Fan Assembly Packaging Based on ANSYS Workbench[J]. Packaging Engineering. 2013(13): 56-58

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