Preparation Technology of Thin Rice-Straw Particleboard for Packaging

REN Li-min, WANG Feng-hu, ZHANG Li

Packaging Engineering ›› 2013 ›› Issue (11) : 10-15.

Packaging Engineering ›› 2013 ›› Issue (11) : 10-15.

Preparation Technology of Thin Rice-Straw Particleboard for Packaging

  • REN Li-min, WANG Feng-hu, ZHANG Li
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Abstract

Based on the design concept of packaging reduction, the preparation technology of thin rice-straw particleboard was studied to provide material support for green packaging design. The effects of hot pressing temperature, hot pressing time and resin content of phenol formaldehyde resin (PF) on the physical and mechanical properties of the particleboard were studied under the condition of 2% MDI resin content. The internal bonding strength and thickness swelling of the thin rice-straw particleboard manufactured using the best production technology did not meet the national standard. When MDI resin content increases to 3% , the physical and mechanical properties of particleboard manufactured using the best production technology, which is the hot pressing temperature of 150 ℃ , the hot pressing time of 2. 0 min/ mm, the PF resin content of 14% , and the liquid paraffin content of 1% , meets the requirements of the national standard.

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REN Li-min, WANG Feng-hu, ZHANG Li. Preparation Technology of Thin Rice-Straw Particleboard for Packaging[J]. Packaging Engineering. 2013(11): 10-15

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