Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry

ZHANG Tian-cai; WANG Yong-feng; ZHANG Kai; YANG Qi; LIU Xiao-hui; WANG Yan-yan

ZHANG Tian-cai, WANG Yong-feng, ZHANG Kai, YANG Qi, LIU Xiao-hui, WANG Yan-yan

Packaging Engineering ›› 2013 ›› Issue (7) : 7-9.

Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry

ZHANG Tian-cai¹, WANG Yong-feng¹, YANG Qi¹, LIU Xiao-hui¹, WANG Yan-yan¹, ZHANG Kai²

Author information +

History +

Abstract

Curing behavior of polyether amine / phenolic amine-epoxy resin system was studied using DSC at heating rates of 5, 10, 15 and 20 ℃ / min from 25 ℃ to 230 ℃ , and the curing states were analyzed in different heating rates. At last, initial curing temperature, maximum curing temperature, and terminal curing temperature were calculated by extrapolating T-β.

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

ZHANG Tian-cai, WANG Yong-feng, ZHANG Kai, YANG Qi, LIU Xiao-hui, WANG Yan-yan. Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry[J]. Packaging Engineering. 2013(7): 7-9