The adhesion strength of EVA encapsulation films to glass substrates is an important factor influencing the performance, reliability and durability of photovoltaic modules. Coupling agent and tackifying resins were applied to improve the adhesion strength. The effect of the type of silane coupling agents, the content and type of tackifying resins on the peeling strength between EVA and glass substrates were discussed. The experimental results showed that the initial adhesion strength of EVA encapsulation film reached 85N/ cm when the mixtures of KH570, KH550 silane coupling agents and 0. 2% modified rosin resin was added.