Research of Substrate Thermodynamic Performance in Thermal Transfer Printing

LI Si-hui, QIAN Jun-hao

Packaging Engineering ›› 2013 ›› Issue (1) : 119-122.

Packaging Engineering ›› 2013 ›› Issue (1) : 119-122.

Research of Substrate Thermodynamic Performance in Thermal Transfer Printing

  • LI Si-hui, QIAN Jun-hao
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Abstract

Temperature and pressure of thermal transfer printing are the key factors influencing printing quality. The thermodynamic performance of substrate in thermal transfer printing was studied. The creep curve of the substrate in high temperature and thermal transfer printing quality influenced by transfer temperature, transfer time and printing pressure was analyzed. The purpose was to provide a theoretical basis for determination of transfer temperature, transfer time and printing pressure in actual printing operation.

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LI Si-hui, QIAN Jun-hao. Research of Substrate Thermodynamic Performance in Thermal Transfer Printing[J]. Packaging Engineering. 2013(1): 119-122

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