Drop Simulation Analysis and Structure Design of Product Based on ANSYS

WANG Chang-zhi, CHEN Wen-ge

Packaging Engineering ›› 2013 ›› Issue (1) : 44-46.

Packaging Engineering ›› 2013 ›› Issue (1) : 44-46.

Drop Simulation Analysis and Structure Design of Product Based on ANSYS

  • WANG Chang-zhi, CHEN Wen-ge
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Abstract

Finite element analysis software ANSYS was taken as platform and the geometrical model of a MP3 electronic product was taken as an objective through the simulation and analysis of drop processes. The new method and way of thinking was put forward for product design and study of packaging technology. The method can shortening product design period and reducing development cost, and improving reliability of product.

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WANG Chang-zhi, CHEN Wen-ge. Drop Simulation Analysis and Structure Design of Product Based on ANSYS[J]. Packaging Engineering. 2013(1): 44-46

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