Optimization of Bamboo Chip Dyeing Process Assisted by Ultrasonic

SUN De-bin, LIU Wen-jin, HAO Jing-xin, SUN De-lin

Packaging Engineering ›› 2012 ›› Issue (17) : 74-78.

Packaging Engineering ›› 2012 ›› Issue (17) : 74-78.

Optimization of Bamboo Chip Dyeing Process Assisted by Ultrasonic

  • SUN De-bin, LIU Wen-jin, HAO Jing-xin, SUN De-lin
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Abstract

Bamboo chips were dyed with ultrasonic assisted process. The effects of ultrasonic power, frequency and ultrasonic assisted dyeing time on the dye uptake were discussed under condition of constant mass fraction of dye solution, pH value, and dying temperature. A quadratic regression model was established with response surface methodology based on single factor experiment, and the process was optimized. The result showed that the dye uptake increases when using ultrasound; the optimized parameters are ultrasonic power 525 W, ultrasonic frequency 30 kHz, dyeing temperature 70 ℃, dye mass fraction of solution 1.0%, and dyeing time 52 min; the dye uptake reaches to 34.17%, which increases 8.43% compared with the process without ultrasonic assistance.

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SUN De-bin, LIU Wen-jin, HAO Jing-xin, SUN De-lin. Optimization of Bamboo Chip Dyeing Process Assisted by Ultrasonic[J]. Packaging Engineering. 2012(17): 74-78

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