Finite Element Analysis of Die-cutter Frame

XUE Chao-zhi, QI Yuan-sheng, ZHANG Wei, WANG Xiao-hua, GENG Wu-shuai

Packaging Engineering ›› 2011 ›› Issue (9) : 62-65.

Packaging Engineering ›› 2011 ›› Issue (9) : 62-65.

Finite Element Analysis of Die-cutter Frame

  • XUE Chao-zhi, QI Yuan-sheng, ZHANG Wei, WANG Xiao-hua, GENG Wu-shuai
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Abstract

As horizontal type plan die-cutter works, die-cutting pressure will cause distortion of bilateral wallboard and. The relationship between die-cutting pressure and bilateral wallboard was studied. The thickness of wallboard and upper platform was determined with theoretical calculation. Finite element analysis was carried out on wallboard and upper platform and the results showed that the strength and rigidity of wallboard and upper platform all accord with demands. Functional relation between die-cutting pressure and frame stress, strain was acquired.

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XUE Chao-zhi, QI Yuan-sheng, ZHANG Wei, WANG Xiao-hua, GENG Wu-shuai. Finite Element Analysis of Die-cutter Frame[J]. Packaging Engineering. 2011(9): 62-65

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