Nondestructive Examination of Plastic Sealing Materials by ESSPI

MI Hong-lin, HE Xiao-yuan

Packaging Engineering ›› 2011 ›› Issue (5) : 29-31.

Packaging Engineering ›› 2011 ›› Issue (5) : 29-31.

Nondestructive Examination of Plastic Sealing Materials by ESSPI

  • MI Hong-lin1, HE Xiao-yuan2
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Abstract

In order to test the sealed performance of plastic product for light industry, sealed cap, medical sealed device and sealed part for food plastic bag were tested by ESSPI technique respectively. The results showed that deflects of different sealed devices, different parts, dimensions, and shape can be identified by ESSPI method. Simultaneously, this technique is convenience for operation and is very sensitive to the deflective parts. ESSPI method can be used in nondestructive test on spot.

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MI Hong-lin, HE Xiao-yuan. Nondestructive Examination of Plastic Sealing Materials by ESSPI[J]. Packaging Engineering. 2011(5): 29-31

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