Effect of Complex Stress on the Reliability of Ultra Thin Stacked Packaging Structure in Damp and Hot Environments

HUANG Zhaoling; ZHANG Yutang; LIU Ying; GONG Yubing; LIU Jun; ZHU Lin

doi:10.19554/j.cnki.1001-3563.2026.17.035

PDF(9632 KB)

Packaging Engineering ›› 2026, Vol. 47 ›› Issue (17) : 344-354. DOI: 10.19554/j.cnki.1001-3563.2026.17.035

Equipment Protection

Effect of Complex Stress on the Reliability of Ultra Thin Stacked Packaging Structure in Damp and Hot Environments

HUANG Zhaoling^1,2, ZHANG Yutang², LIU Ying², GONG Yubing², LIU Jun³, ZHU Lin^1,*

Author information +

History +

Abstract

With the development of microelectronic packaging technology towards miniaturization, high density, high reliability, and low power consumption, stacked packaging devices are confronted with severe heat dissipation challenges, stress concentration at heterogeneous interfaces, and failure risks in damp and hot environments. Therefore, it is urgent to deeply investigate the mechanism of complex stress on stacked packaging devices under damp and hot environments from a theoretical perspective, so as to break the technical bottleneck of failure. Through distributed finite element simulation techniques, based on Fick's diffusion law, a moisture diffusion model was constructed. The relative humidity field variable was introduced to handle the discontinuity of moisture concentration in multi-material systems, and a damp-hot-mechanical stress model was established to systematically investigate how structural parameters of ultra thin stacked package affected the distribution and evolution of complex stress associated with damp and hot reliability. There was a large gradient of moisture concentration at the interface between the chip bonding layer and the molding compound, and the uneven distribution of moisture concentration inside the package led to the concentration of damp and hot stress. The maximum value was located at the bottom corner of the bottom chip (287.6 MPa). The ratio of damp stress to thermal stress in the double-layer stacked package was about 1∶2.76, and in the ultra thin stacked package, the ratio was about 1∶3.95. For packages with different top chip area shapes, the maximum difference in damp and hot stress reached 75.2 MPa. Meanwhile, the substrate thickness exerted a significant effect on the damp and hot reliability of the package. When the substrate thickness was optimized from 0.3 mm to 0.1 mm, the maximum damp and hot mechanical stress decreased by 28.89%. This work reveals the effect mechanism of moisture diffusion and damp and hot mechanical stress on the failure of stacked packaging devices, providing a theoretical basis for solving the reliability problem of stacked package in damp and hot environments, and is of great significance for improving the reliability of stacked package.

Key words

stacked package / damp and hot reliability / moisture diffusion / damp and hot mechanical stress / finite element analysis

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

HUANG Zhaoling, ZHANG Yutang, LIU Ying, GONG Yubing, LIU Jun, ZHU Lin. Effect of Complex Stress on the Reliability of Ultra Thin Stacked Packaging Structure in Damp and Hot Environments[J]. Packaging Engineering. 2026, 47(17): 344-354 https://doi.org/10.19554/j.cnki.1001-3563.2026.17.035

References

[1] TANG Z H, XIAN, W K, et al.From Bonds to Breaks: Multiscale Perspectives on Polymer Network Fracture[J]. International Journal of Smart and Nano Materials, 2025, 16(4): 779-844.
[2] SHARMA M K, RAMOS A B.Thermal Management of 3-D Heterogeneously Integrated Microelectronics: Challenges and Future Research Directions[J]. Communications Engineering, 2026, 5(1): 28-46.
[3] WANG Y K, LIU H Z, HUO L H, et al.Research on the Reliability of Advanced Packaging Under Multi-Field Coupling: A Review[J]. Micromachines, 2024, 15(4): 422-429.
[4] 高健宝, 李雪嵩, 杨海亮. 银微纳材料在高分子复合材料领域的应用[J]. 功能材料与器件学报, 2026, 32(2): 021104.
GAO J B, LI X S, YANG H L.Applications of silver micro-nano material in the field of polymer composites[J]. Journal of Functional Materials and Devices, 2026, 32(2): 021104.
[5] LAKKARAJU A R, HELENE C G, AMBAT R, et al.Study of Interaction between Reflow Solder Flux and Humidity in Relation to Failures in Electronics[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(3): 510-518.
[6] 叶安林, 秦连城, 康雪晶. 潮湿扩散及湿热应力对叠层封装件可靠性影响[J]. 电子元件与材料, 2008, 27(1): 69-73.
YE A L, QIN L C, KANG X J.The Influence of Moisture Diffusion and Damp Heat Stress on the Reliability of Stacked Packaging Components[J]. Electronic Components and Materials, 2008, 27(1): 69-73.
[7] LI Z, LI H, QIU T, et al.Reliability Criterion of Film Capacitor Based on Moisture Diffusion in Encapsulation[J]. High Voltage, 2023, 8(6): 1242-1252.
[8] DHANASEKAR S, STELLA T J, THENMOZHI A, et al.Study of Polymer Matrix Composites for Electronics Applications[J]. Journal of Nanomaterials, 2022, 2022(1): 8605099.
[9] WANG Y, AHMAD I, LEUNG T, et al.Encapsulation and Stability Testing of Perovskite Solar Cells for Real Life Applications[J]. ACS Materials Au, 2022, 2(3): 215-236.
[10] LI K, ZHANG B, YANG Z, et al.Degradation Behaviors of Silicone Gel Encapsulation Material with Moisture Intrusion[J]. Polymer Degradation and Stability, 2022, 206: 110197.
[11] WONG E H, KOH S W, LEE K H, et al.Advanced Moisture Diffusion Modeling and Characterisation for Electronic Packaging[C]// Proceedings of 52nd Electronic Components and Technology Conference 2002. Paris: IEEE, 2002: 1297-1303.
[12] KIM H S, SONG H G.Investigation of Moisture-Induced Failures of Stacked-Die Package[J]. Microelectronics Reliability. Elsevier, 2007, 47(9-11): 1673-1679.
[13] LEE Y H, CHIN I, LOH W K.Electronic Packaging Moisture Interaction Study[C]// Proceedings of the 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT). Paris: IEEE, 2018: 1-8.
[14] MITTERHOFER S, SLAPSAK J, ASTIGARRAGA A, et al.Measurement and Simulation of Moisture Ingress in PV Modules in Various Climates[J]. IEEE Journal of Photovoltaics, 2023, 14(1): 140-148.
[15] JANSEN K M B, ZHANG M F, ERNST L J, et al. Effect of Temperature and Humidity on Moisture Diffusion in an Epoxy Moulding Compound Material[J]. Microelectronics Reliability, 2020(107): 113596-113596.
[16] KHANAL M, ZHOU J, FAN X.Analytical Solution for Moisture Diffusion with Initial Non-Uniform Moisture Concentration Used in Bake Time Study in Electronics Packaging[C]// Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Paris: IEEE, 2023: 1-7.
[17] SALAHOUELHADJ A, GONZALEZ M, PODPOD A, et al.Investigating Moisture Diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)[C]// Proceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Paris: IEEE, 2022: 1704-1710.
[18] HWANG Y T, UM H J, YU M H, et al.Finite Element Analysis of Moisture Induced Thermo-Mechanical Delamination of Semiconductor Packages Considering In-Situ Moisture Desorption During Reflow Process[J]. Microelectronics Reliability. Elsevier Ltd, 2021(121): 144-146.
[19] ZHENG L, DENG Y K, WANG H G, et al.Moisture Desorption and Hygro-Vapor-Thermal Induced Interfacial Delamination in Underfilled FCBGA Package During Reflow Process[C]// Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). Paris: IEEE, 2022: 1-5.
[20] ZHAO T, WEI H, GE H.The Stress Analysis of Moisture-Thermal Coupling Based on an Advanced 3D Packaging[C]// Proceedings of the 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM). Paris: IEEE, 2022: 110-118.
[21] DONG H, LIU D, ZHOU J, et al.Reliability Analysis of 2.5D Package Structure Based on Thermal-Moisture-Mechanical Coupling[C]// Proceedings of the 2024 25th International Conference on Electronic Packaging Technology (ICEPT). Paris: IEEE, 2024: 1-5.
[22] CHEN L, FAN X, LIU Y.A Direct Multi-Field Coupling Methodology for Modeling Moisture-Induced Stresses and Delamination in Electronic Packages[C]// Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Paris: IEEE, 2020: 1064-1069.
[23] ZHOU S, MA K, WU Y, et al.Survey of Reliability Research on 3D Packaged Memory[J]. Electronics, 2023, 12(12): 2709-2718.
[24] INAMDAR A, VANDRIEL W D, ZHANG G Q.Electronics Packaging Materials and Component-Level Degradation Monitoring[J]. Frontiers in Electronics, 2025(6): 1506112.
[25] 蒋海华, 马孝松. SiP器件回流焊时湿热应力的分析[J]. 电子元件与材料, 2009, 28(1): 56-59.
JIANG H H, MA X S.Analysis of Damp Heat Stress during Reflow Soldering of SiP Devices[J]. Electronic Components and Materials, 2009, 28(1): 56-59.
[26] SHI X, QIU Y, ZHANG J, et al.Research on the Relationship between Time-Dependent Strains and Delamination of Plastic Packaged Devices at Polymer/Copper Interface under Thermal-Hygro Environments[J]. Modelling and Simulation in Materials Science and Engineering, 2022, 30(6): 065002.