Preparation and Application of PI/SCIP-Gly Composite Films in Microwave Heating

JI Yuxi; YANG Qinan; FU Zhiqiang; HUANG Liqiang

doi:10.19554/j.cnki.1001-3563.2026.09.016

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Packaging Engineering ›› 2026, Vol. 47 ›› Issue (9) : 150-158. DOI: 10.19554/j.cnki.1001-3563.2026.09.016

Advanced Materials

Preparation and Application of PI/SCIP-Gly Composite Films in Microwave Heating

JI Yuxi^a,b, YANG Qinan^a,b, FU Zhiqiang^a,b, HUANG Liqiang^a,b,*

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Abstract

The work aims to develop a packaging material with microwave thermal conversion capabilities to enhance microwave heating uniformity and reduce the moisture loss rate of food. An efficient thermal conversion energy absorption composite film was prepared with polyimide (PI) as the substrate of film, N,N-Dimethylacetamide (DMAC) as solvent, spherical carbonyl iron powder (SCIP) as the component of microwave thermal conversion by solution casting. The effects of different concentrations of glycine modifier (Gly), Kh-560 and Cs modifier on the dispersion of SCIP were compared, and the modifier with the best performance was selected to modify SCIP. A comparative microwave heating experiment was conducted on refrigerated steamed breads with and without films. The effect of films during microwave heating was evaluated by measuring temperature changes and water loss rate. When the mass fraction of Gly was 3%, the modification effect on SCIP was optimal, effectively solving the problem of agglomeration. After the PI was mixed with 25% SCIP-Gly, the elastic modulus was 992.7 MPa. Compared with the pure PI film, the elastic modulus of the new film increased by a factor of 2.49. The minimum moisture-vapor transmission was 4.99 g/(m²·h) and the mechanical properties and barrier properties were better. A contrastive experiment was carried out the packaging film of refrigerated steamed bread with and without films at different heating temperatures (20-120 ℃), and the results showed that the temperature difference between inside and outside of steamed bread decreased from 27.8 °C to 8.4 °C, representing a 69.8% reduction. The water loss rates decreased from 0.409 0% to 0.024 4%, representing a 94.0% reduction. Overall, the developed PI/SCIP-Gly composite film has high temperature resistance which can greatly reduce the water loss rate of food and maintain the taste of food to the greatest extent. It is expected to improve the quality of food and has practical application value in microwave heating.

Key words

microwave heating / polyimide (PI) / temperature distribution / water loss rate

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JI Yuxi, YANG Qinan, FU Zhiqiang, HUANG Liqiang. Preparation and Application of PI/SCIP-Gly Composite Films in Microwave Heating[J]. Packaging Engineering. 2026, 47(9): 150-158 https://doi.org/10.19554/j.cnki.1001-3563.2026.09.016

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