Preparation and Bonding Performance of Eco-friendly Soy Protein-Dialdehyde Cellulose Adhesive

YANG Zitian; WANG Peng

doi:10.19554/j.cnki.1001-3563.2026.09.013

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Packaging Engineering ›› 2026, Vol. 47 ›› Issue (9) : 125-132. DOI: 10.19554/j.cnki.1001-3563.2026.09.013

Advanced Materials

Preparation and Bonding Performance of Eco-friendly Soy Protein-Dialdehyde Cellulose Adhesive

YANG Zitian, WANG Peng^*

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Abstract

The work aims to solve the problem that soy protein-based adhesives are limited in practical applications due to poor water resistance and insufficient bonding strength. Dialdehyde cellulose (DAC) was synthesized through periodate oxidation of microcrystalline cellulose and incorporated into soy protein isolate (SPI) system as a reactive crosslinker for fabricating poplar plywood. By systematically varying hot-pressing conditions (temperature, pressure, duration) and DAC loading levels, the effects of DAC on bonding performance was evaluated. A suite of characterization techniques, including FTIR, XPS, scanning electron microscopy (SEM), optical microscope (OM), and contact angle test were employed to probe the underlying enhancement mechanism. Under optimized conditions (170 °C, 1.0 MPa, 40 min) with 50 wt% DAC relative to SPI, the wet bonding strength reached 2.24 MPa, which was more than three times that of the national standard for Class Ⅱ plywood (0.7 MPa), demonstrating excellent water resistance. Further analysis showed that, during hot pressing, aldehyde groups on DAC reacted with amino groups in SPI to form C-N covalent linkages and new amide structures, thereby establishing a robust three-dimensional crosslinked network. The strategy presented here offers a practical route for solving the poor water resistance and insufficient strength of SPI adhesives.

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adhesive / soy protein / dialdehyde cellulose / plywood

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YANG Zitian, WANG Peng. Preparation and Bonding Performance of Eco-friendly Soy Protein-Dialdehyde Cellulose Adhesive[J]. Packaging Engineering. 2026, 47(9): 125-132 https://doi.org/10.19554/j.cnki.1001-3563.2026.09.013

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