Research Progress of Finite Element Simulation Application for Packaging

ZHAO Jizhong; DENG Yi; YE Genjun; YANG Duobing; LI Shuang; JIANG Kunyang; LIANG Shenghua; AN Mingzhe

doi:10.19554/j.cnki.1001-3563.2026.05.031

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Packaging Engineering ›› 2026, Vol. 47 ›› Issue (5) : 303-316. DOI: 10.19554/j.cnki.1001-3563.2026.05.031

Green Packaging and Circular Economy

Research Progress of Finite Element Simulation Application for Packaging

ZHAO Jizhong^a, DENG Yi^b, YE Genjun^a,*, YANG Duobing^a, LI Shuang^b, JIANG Kunyang^c, LIANG Shenghua^a, AN Mingzhe^b,c

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Abstract

The work aims to comprehensively summarize the current application status, challenges, and future trends of finite element (FE) simulation in packaging, providing reference for subsequent research and application in this field. The research progress was reviewed from static and quasi-static analysis, dynamic impact response, thermal behavior, multi-physics coupling, lightweight design and structural optimization, and other emerging simulation directions. Furthermore, a statistical analysis was performed on the application characteristics of simulation software in the field, presenting the application workflow of packaging finite element simulation in aiding packaging design, analyzing existing challenges and forecasting future trends. The results indicated that drop impact simulation was the primary application direction, while other simulation fields were progressively evolving. ANSYS, ABAQUS, MSC, HyperWorks, COMSOL, and PAM-CRASH were identified as the core software tools widely used in this field. Currently, several critical challenges exist in the application of packaging FE simulation, such as the low accuracy of material constitutive models, the high complexity of multi-physics coupling simulations, difficulties in mesh generation and model construction, bottlenecks in computational resources and efficiency, inconsistencies between actual working conditions and simulation boundary conditions, as well as high costs and steep talent thresholds. In the future, packaging FE simulation is expected to evolve toward intelligent and high-precision material models, the engineering application of multi-physics coupling simulations, the construction of high-fidelity refined simulation models, the simulation optimization for green and sustainable packaging, and the integration of simulation tools as well as ecosystem development.

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packaging / finite element method / simulation / reliability / application / research progress

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ZHAO Jizhong, DENG Yi, YE Genjun, YANG Duobing, LI Shuang, JIANG Kunyang, LIANG Shenghua, AN Mingzhe. Research Progress of Finite Element Simulation Application for Packaging[J]. Packaging Engineering. 2026, 47(5): 303-316 https://doi.org/10.19554/j.cnki.1001-3563.2026.05.031

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