Development Trends and Challenges of Flexible Pressure Sensors and Their Miniaturization

XU Guangyi; LI Yan; GU Jintao; ZHU Tingxuan; LIU Fu

doi:10.19554/j.cnki.1001-3563.2025.21.002

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Packaging Engineering ›› 2025, Vol. 46 ›› Issue (21) : 11-21. DOI: 10.19554/j.cnki.1001-3563.2025.21.002

Advanced Materials

Development Trends and Challenges of Flexible Pressure Sensors and Their Miniaturization

XU Guangyi, LI Yan^*, GU Jintao, ZHU Tingxuan, LIU Fu

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Abstract

The work aims to elucidate the current development trends and core challenges in the miniaturization of flexible pressure sensors, and discuss key bottlenecks related to performance trade-offs, scalable fabrication, system integration, and long-term reliability. A systematic review and a comparative analysis were conducted to examine the sensing mechanisms, key materials, and core miniaturization technologies of mainstream flexible pressure sensors, along with their current applications. The findings revealed that integrating microstructural designs with advanced manufacturing processes constituted a core pathway toward miniaturization. While the technological maturity and application potential vary among different sensing mechanisms, pervasive challenges remained, including the intrinsic trade-off between sensitivity and measurement range and the need for further manufacturing process optimization. To address these challenges, future research should be directed toward developing novel materials, achieving multi-modal sensing integration, advancing self-powered systems, and incorporating artificial intelligence algorithms, so as to overcome existing bottlenecks and propel the in-depth application of flexible pressure sensors in fields such as intelligent healthcare and human-computer interaction.

Key words

flexible pressure sensor / miniaturization / sensing mechanism / piezoresistive sensor / intelligent packaging

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XU Guangyi, LI Yan, GU Jintao, ZHU Tingxuan, LIU Fu. Development Trends and Challenges of Flexible Pressure Sensors and Their Miniaturization[J]. Packaging Engineering. 2025, 46(21): 11-21 https://doi.org/10.19554/j.cnki.1001-3563.2025.21.002

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