The work aims to design a low-weight and high-pallet molded pulp package for laptop computer to estimate and verify the protection of the new scheme for the computer in the drop test. Combined with the advantages of the structures in the existing inward and outward package schemes, a V-shaped molded pulp scheme was designed. Based on the drop test conditions, a drop simulation model was established. Through ANSYS/LS-Dyna simulation analysis, the product drop acceleration curve and the molded pulp cracking stress diagrams were obtained. The V-shaped scheme had lower drop acceleration on the side face, top surface, and short edges compared to the original inward scheme. The V-shaped scheme had no cracking under various test conditions. The simulation results were highly consistent with the drop test results. The V-shaped scheme can provide full protection for the computer in the drop test, meet the landing conditions, and has great economic value. The results of finite element analysis have high accuracy, which can provide a basis for the opening and setting of molded pulp packaging of various models and reduce the risk of mold repair.