In-plane Compression Simulation of Honeycomb Paperboard Based on the Constitutive Model of Paper

HAO Qianchong, SUN Deqiang, MA Xingyuan, LI Xiang, SONG Yaling, LI Xinyi, YE Runjie, MA Yi

Packaging Engineering ›› 2025 ›› Issue (3) : 150-157.

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Packaging Engineering ›› 2025 ›› Issue (3) : 150-157. DOI: 10.19554/j.cnki.1001-3563.2025.03.018

In-plane Compression Simulation of Honeycomb Paperboard Based on the Constitutive Model of Paper

  • HAO Qianchong1, SUN Deqiang1, MA Xingyuan1, LI Xiang1, SONG Yaling1, LI Xinyi1, YE Runjie1, MA Yi2
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Abstract

Based on the study of the constitutive model of paper, the work aims to achieve the accurate simulation of in-plane compression of honeycomb paperboard. LS-DYNA software, the MAT_274_PAPER material model was adopted to construct the constitutive model of honeycomb base paper. The material parameters of each piece of base paper required for constructing the constitutive model were measured through tensile tests in different directions. The in-plane compression tests were carried out to obtain the stress-strain curves and corresponding edge compression strength values of honeycomb paperboard. LS-DYNA software was used to construct the finite element model of honeycomb paperboard under in-plane compression to obtain simulated values of edge compression strength. The theoretical value of edge compression strength was obtained based on the existing calculation method for honeycomb paperboard. By comparing and analyzing the theoretical, simulated, and experimental values of edge compression strength for honeycomb paperboard with different configuration parameters, the reliability of the simulation model was verified, with the errors all within 5%. The in-plane compression simulation model for honeycomb paperboard proposed based on the constitutive model of paper takes into account the specific mechanical behavior of paper materials and is more closely aligned with actual conditions, resulting in more accurate simulation outcomes.

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HAO Qianchong, SUN Deqiang, MA Xingyuan, LI Xiang, SONG Yaling, LI Xinyi, YE Runjie, MA Yi. In-plane Compression Simulation of Honeycomb Paperboard Based on the Constitutive Model of Paper[J]. Packaging Engineering. 2025(3): 150-157 https://doi.org/10.19554/j.cnki.1001-3563.2025.03.018
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