Wood Bonding Properties of Biomass Adhesives Enhanced by Chemically Active Bonding Interface

LIU Tongda, DU Guanben, HUANG Tenghua, PAN Licheng, YANG Long

Packaging Engineering ›› 2024 ›› Issue (23) : 1-9.

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Packaging Engineering ›› 2024 ›› Issue (23) : 1-9. DOI: 10.19554/j.cnki.1001-3563.2024.23.001

Wood Bonding Properties of Biomass Adhesives Enhanced by Chemically Active Bonding Interface

  • LIU Tongda1, DU Guanben1, YANG Long1, HUANG Tenghua2, PAN Licheng3
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Abstract

The work aims to develop a bio-based adhesive, apply it to the preparation of wood-based composites and further investigate the effect of chemical activated bonding interface construction on the bonding properties. Tannin was oxidized and cellulose was modified with amino group, and a tannin-cellulose biomass-based adhesive was designed, and an activated wood surface rich in epoxy groups was constructed by grafting 3-glycidoxypropyltrimethoxysilane to the natural wood surface. A chemical activated bonding interface was constructed by reacting the epoxy groups on the activated wood surface with the —NH2 groups in the adhesive during the hot-pressing process. The effect of chemical activated bonding interface construction on the bonding properties was explored by DSC, DMA, and mechanical properties tests. A ultrastrong, water-resistant, all-biomass wood bonding interface was constructed, and the dry, hot, and boiling water bonding strengths of the bonding specimens were 3.27, 2.15, and 1.85 MPa, respectively. The wet strength increased significantly from 0 MPa to 2.15 MPa and 1.85 MPa. The interaction between the adhesive and the wood surface, i.e., the formation of a chemical bonding interface between the adhesive and the chemical activated wood surface, significantly enhances the bonding properties and water resistance of the bonding products.

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LIU Tongda, DU Guanben, HUANG Tenghua, PAN Licheng, YANG Long. Wood Bonding Properties of Biomass Adhesives Enhanced by Chemically Active Bonding Interface[J]. Packaging Engineering. 2024(23): 1-9 https://doi.org/10.19554/j.cnki.1001-3563.2024.23.001
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