The work aims to design and optimize the drop buffer packaging of integrated stoves and verify the packaging by physical prototype test and ensure that it is in line with the requirements of container loading quantity. The minimum thickness was obtained from the initial design of the packaging carried out by the buffer coefficient method. Then, a finite element model simulating drop test was established by ABAQUS to obtain accurate fragility to adjust the minimum thickness, thus determining whether the packaging dimension met the constraints. Finally, local optimization of the packaging was carried out based on failure analysis of the drop process through displacement cloud map and equivalent plastic strain cloud map. Meanwhile, the schemes before and after improvement were verified by physical prototype test. The cloud map of the simulation model showed that the equivalent plastic strain of the side panel based on the optimized packaging was reduced from 0.158 to 0.020, meeting the qualified standard of simulation judgment and matching with the test results while ensuring the container loading quantity. The design method combining simulation models and buffer coefficients method can guide packaging design effectively, saving test resources and shortening the development cycle.