The work aims to study the effect of surface modification of boron nitride nanosheets on the performance of thermal conductive coatings, so as to improve the heat dissipation of microelectronic products. Starting from the preparation of boron nitride nanosheets, surface treatment techniques of covalent and non-covalent bond modified boron nitride nanosheets were introduced. The research progress on preparing thermal conductive coatings by combining boron nitride nanosheets with polymer materials such as epoxy resin, polyurethane resin, and organosilicon resin, as well as the current problems of boron nitridenanosheets used in thermal conductive coatings were summarized. The top-down strategy was the most widely used strategy in the preparation of boron nitride nanosheets. Modifying boron nitride nanosheetswith covalent and non-covalent bonds could effectively improve the compatibility between boron nitride nanosheetsand polymer resins, thereby enhancing the thermal conductivity of boron nitridenanosheets/polymer composite coatings. Surface modification of boron nitride nanosheets has broad application prospects in thermal conductive coatings, and will provide more effective solutions for the heat dissipation problem of microelectronic products.