PDF(2038 KB)
Preparation of High Barrier and Thermal Conductive Lining Paper for Packaging by Modified Boron Nitride
DENG Jiayun, PENG Qiang, LIN Wenlong, ZHOU Di, LI Yihua, XIE An, LAI Jiacheng
Packaging Engineering ›› 2024 ›› Issue (17) : 105-110.
PDF(2038 KB)
PDF(2038 KB)
Preparation of High Barrier and Thermal Conductive Lining Paper for Packaging by Modified Boron Nitride
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