Anti-counterfeit and Waste-free Packaging Based on Paper-based Microfluidic Chip

YANG Chen, LEI Wencai

Packaging Engineering ›› 2024 ›› Issue (13) : 98-103.

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PDF(4330 KB)
Packaging Engineering ›› 2024 ›› Issue (13) : 98-103. DOI: 10.19554/j.cnki.1001-3563.2024.13.012

Anti-counterfeit and Waste-free Packaging Based on Paper-based Microfluidic Chip

  • YANG Chen, LEI Wencai
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Abstract

In the context of the growing awareness of environmental protection today, paper-based microfluidic technology, characterized by low cost and biodegradability, has gradually become a hot topic of research in the packaging industry. The work aims to design multifunctional packaging utilizing paper-based microfluidic chip technology, which utilizes the unique fluorescent response of carbon dots for anti-counterfeiting purposes and integrates a teaching component through the use of conductive ink devices to meet the contemporary environmental standards for waste-free packaging materials. Through the utilization of silk screen printing technique, a paper-based microfluidic chip integrating fluorescent sensing and conductive ink components was fabricated, adhered onto the inner surface of conventional paper packaging to create waste-free anti-counterfeit packaging. This integration allowed for product authenticity verification under UV light irradiation and offered an educational dimension through luminescence demonstration post-application of conductive ink. The fusion of paper-based microfluidic chips with paper packaging presents a viable approach for enhancing product security and promoting sustainable packaging practices.

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YANG Chen, LEI Wencai. Anti-counterfeit and Waste-free Packaging Based on Paper-based Microfluidic Chip[J]. Packaging Engineering. 2024(13): 98-103 https://doi.org/10.19554/j.cnki.1001-3563.2024.13.012
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