Construction and Verification of Thin Film Temperature Constitutive Model Based on Finite Element Correction Method

ZHANG Guipeng, FU Zhiqiang, LIU Haozhe, ZHAO Zhongjian, ZHAO Tong, DUAN Liying

Packaging Engineering ›› 2024 ›› Issue (13) : 69-78.

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Packaging Engineering ›› 2024 ›› Issue (13) : 69-78. DOI: 10.19554/j.cnki.1001-3563.2024.13.009

Construction and Verification of Thin Film Temperature Constitutive Model Based on Finite Element Correction Method

  • ZHANG Guipeng1, LIU Haozhe1, ZHAO Tong1, FU Zhiqiang2, ZHAO Zhongjian3, DUAN Liying4
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Abstract

Because the thin film is prone to necking under stress, and has strong temperature dependence, the existing engineering stress-strain and constitutive model can not accurately describe the load displacement curve of the thin film material under the temperature change, resulting in a serious inconsistency between the predicted results and the actual situation, which needs to be solved urgently. Under the conditions of quasi-static tension (10 mm/min) and different temperature (−20, 0, 20, 40, 60 ℃), the uniaxial tensile test of PE/PA/PE film samples was carried out with an universal material testing machine. The plastic stress of the material was modified based on the finite element correction method. The elastic modulus and yield strength of PE/PA/PE films were described by the exponential function, and the shape function in the Johnson cook constitutive model was modified. Combined with the temperature term of strain temperature coupling, the plastic stress-strain model of PE/PA/PE films under 100 % strain was constructed, and the simulation was carried out in single-layer PE and five-layer PE/PA/PE/PA/PE films. The necking of the film increased from 7.86 to 8.12 mm in the 100 % strain range at −20-60 ℃; The elastic modulus, yield strength and plastic stress decreased nonlinearly with the increase of temperature; Based on the finite element correction method, the real stress and strain were corrected and compared. It was found that the relative error decreased from 83.94% to 4.73%; The elastic modulus and yield strength were fitted by exponential function, and the R2 values were 0.936 and 0.947, respectively; Compared with the original model, the relative error of the improved shape function was reduced from 42.5% to 6.49%; The maximum relative error between the temperature term and the corrected stress-strain was 7.21%. The maximum relative error of the new model applied to PE and PE/PA/PE/PA/PE films was 4.91%. In the temperature range of −20-60 ℃, the modified finite element method and the modified constitutive model can well describe the variation of yield strength, elastic modulus and plastic stress with temperature when the strain is within 100 %. The research results lay a theoretical foundation for the application of thin films.

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ZHANG Guipeng, FU Zhiqiang, LIU Haozhe, ZHAO Zhongjian, ZHAO Tong, DUAN Liying. Construction and Verification of Thin Film Temperature Constitutive Model Based on Finite Element Correction Method[J]. Packaging Engineering. 2024(13): 69-78 https://doi.org/10.19554/j.cnki.1001-3563.2024.13.009
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