The work aims to develop a heat transfer simulation system for insulating packaging and effectively analyze the heat insulation effect of insulating packaging. With typical insulating packaging as the research object, a parametric modeling module of insulating packaging was designed based on OpenCASCADE, QT and VTK. The law of heat transfer inside and outside the packaging was analyzed, and the module of heat transfer solver for insulating package was developed. Two modules were integrated to realize the parametric modeling of insulating packaging and the numerical simulation of the heat transfer. Tpackage was used to conduct heat transfer simulation for two sets of insulating packaging (TC1 and TC2) at two ambient temperature of 30 ℃ and 40℃. Comsol was used for simulation under the same conditions. The maximum error of the time when the temperature measuring point reached 8 ℃ was as follows:7.04% (TC1-30 ℃), 9.87% (TC1-40 ℃), 8.82% (TC2-30 ℃), and 9.73% (TC2-40 ℃). The actual experiment was carried out at 30℃, and the comparison and verification under the same conditions by Tpackage showed that the maximum error of the time when the temperature measuring point of the product reached 8 ℃ was 9.47%. Therefore, Tpackage can realize the parametric modeling of typical insulating packaging and effectively evaluate the temperature field distribution in insulating packaging. The research can provide a reference for optimizing the design of insulating packaging and improving the design efficiency.