Design and Simulation Analysis of Floor Mirror Buffer Packaging

GUO Xinming, CHEN Xichun, MA Renyu, SONG Qing

Packaging Engineering ›› 2024 ›› Issue (3) : 299-307.

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Packaging Engineering ›› 2024 ›› Issue (3) : 299-307. DOI: 10.19554/j.cnki.1001-3563.2024.03.035

Design and Simulation Analysis of Floor Mirror Buffer Packaging

  • GUO Xinming, CHEN Xichun, MA Renyu, SONG Qing
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Abstract

The work aims to establish a packaging model through SolidWorks software based on the physical characteristics and transportation environment of floor mirrors, design a packaging product that meets the needs of multiple styles of floor mirrors, and provide a new packaging design concept. Ansys Workbench software was used to simulate the model, complete modal analysis and random vibration simulation analysis, and the built-in display dynamics plugin of Ansys Workbench was used to conduct drop simulation analysis of packaging components, to verify the rationality and feasibility of the design. The comparative analysis results showed that the deformation of the new packaging under impact was much smaller than that of the old packaging, and the distribution was uniform. The probability of the floor mirror being damaged due to its influence was extremely low. In the drop simulation, the equivalent stress on the aluminum alloy lower frame of the floor mirror in the old packaging was 42.158 MPa, which was greater than the allowable stress of the glass mirror of 28 MPa, which could cause damage to the floor mirror in the packaging. In the new packaging, the stress on the aluminum alloy lower frame was less than 28 MPa, and the floor mirror will not be damaged. In conclusion, the design of the floor mirror honeycomb cardboard box and polyethylene foam packaging box in this paper is reasonable. It not only has protective performance better than the original packaging box, but also has a wider scope of application, which proves that the design idea is feasible.

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GUO Xinming, CHEN Xichun, MA Renyu, SONG Qing. Design and Simulation Analysis of Floor Mirror Buffer Packaging[J]. Packaging Engineering. 2024(3): 299-307 https://doi.org/10.19554/j.cnki.1001-3563.2024.03.035
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