The work aims to study the curing reaction behavior of hydantoin epoxy/bisphenol A-type cyanate (BAE) and hydantoin epoxy/tetramethyl bisphenol F-type cyanate (TBF) by nonisothermal differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FT-IR). The curing kinetic parameters of the two resin systems were calculated by Kissinger, Ozawa and Crane methods. Thermogravimetric analysis (TGA) and thermo-mechanical analysis (DMA) were used to evaluate the thermal stability and thermodynamic properties of the resin before and after modification. The modified cyanate resin systems exhibited dual curing exothermic peaks, and the TBF system had relatively higher apparent activation energy, while the BAE system possessed better heat resistance and had a glass transition temperature (tg) of 271.6 ℃ and a thermal decomposition temperature of 403.4 ℃ at a mass rate of 5% under nitrogen. The hydantoin epoxy resin can promote the polymerization of cyanate ester, and the modified resin system can be used in high temperature resistant resin matrix and electronic packaging materials.