Effect of Resistant Dextrin on Rheological Properties of Flour and Gelatinized Gel

LIU De-zhi, WU Yun-jiao, WANG Yi-fei, HU Xin, WEI Chun-hong, WANG Wei-hao, CAO Long-kui

Packaging Engineering ›› 2023 ›› Issue (1) : 253-258.

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Packaging Engineering ›› 2023 ›› Issue (1) : 253-258. DOI: 10.19554/j.cnki.1001-3563.2023.01.028

Effect of Resistant Dextrin on Rheological Properties of Flour and Gelatinized Gel

  • LIU De-zhi, WU Yun-jiao, WANG Yi-fei, HU Xin, WEI Chun-hong, WANG Wei-hao, CAO Long-kui
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Abstract

The work aims to explore the effect of resistant dextrin on the quality characteristics of flour to expand the application of resistant dextrin in flour products. In this work, resistant dextrin was added to flour in different proportions (2.5%-10%). The effects of resistant dextrin on the rheological properties of flour were investigated by farinograph and extensometer. The effects of gelatinization properties and gel structure of flour were investigated by RVA gelatinizer and scanning electron microscope. The results showed that compared with flour without resistant dextrin, the addition of resistant dextrin could significantly prolong the flour stability time and significantly reduce the degree of weakening, improve the overall tensile properties of the wheat dough, and enhance the gluten effect of flour; The characteristics of gelatinization viscosity showed that resistant dextrin could increase the gelatinization temperature of flour, reduce the peak gelatinization viscosity, disintegration value and retrogradation value of flour, improve the thermal stability of flour gelatinization, and delay the short-term retrogradation of gel. It is concluded that resistant dextrin can be used as flour improver to improve the rheological, pasting and gel retrogradation characteristics of flour.

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LIU De-zhi, WU Yun-jiao, WANG Yi-fei, HU Xin, WEI Chun-hong, WANG Wei-hao, CAO Long-kui. Effect of Resistant Dextrin on Rheological Properties of Flour and Gelatinized Gel[J]. Packaging Engineering. 2023(1): 253-258 https://doi.org/10.19554/j.cnki.1001-3563.2023.01.028
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