The work aims to review the latest research on low-Ag Sn-Ag-Cu solder in recent years to demonstrate its broad application prospects in the field of electronic packaging materials, so as to meet the development trend of high-Ag solder to low-Ag solder. Through the analysis on the research results of low-Ag solder at home and abroad, the effects of alloying and particle strengthening on the melting characteristics, wettability, microstructure, interface structure and mechanical properties of low-Ag solder were introduced in detail. The optimum addition amount of element doping and the modification mechanism were summarized. As a result, by adding metal elements, rare earth elements and nanoparticles, the new stirring technology can effectively improve the properties of the solder. The properties of partially modified low-Ag composite solder reach the level of high-Ag solder.