The work aims to improve the unit bonding performance of reed materials and the utilization of reed resources. Isocyanate/urea-formaldehyde resin composite adhesive was adopted to prepare reed particleboard. The orthogonal test with three factors and three levels was used to study the effect of adhesive consumption, hot pressing time and temperature on the static bending strength (MOR), internal bonding strength (IB) and thickness swelling (TS) of the board. When the isocyanate accounted for 11.6% of the composite adhesive, the optimum hot pressing temperature, hot pressing time and adhesive consumption of reed particleboard were 160 ℃, 240 s, and 12%. The MOR, MOE, IB, 2 h TS, and 24 h TS of the reed particleboard under these conditions were 33.68 MPa, 3292 MPa, 1.05 MPa, 3.64%, and 9.45%, meeting the requirements in GB/T 4897-2015 for heavy-duty particleboard (6-13 mm)in dry conditions. This study can broaden the industrial utilization of reed resources to replace wood in the field of packaging materials.