Preparation and Performance of Biomass Composite Packaging Board

FAN Lv-hui, WEI Ling-jun, SHI Yun-qing, LIU Yu-hui, SUN Hao, WANG Hai-jian, QIAN Ao-ran

Packaging Engineering ›› 2022 ›› Issue (21) : 69-77.

PDF(2119 KB)
PDF(2119 KB)
Packaging Engineering ›› 2022 ›› Issue (21) : 69-77. DOI: 10.19554/j.cnki.1001-3563.2022.21.009

Preparation and Performance of Biomass Composite Packaging Board

  • FAN Lv-hui1, WEI Ling-jun1, SHI Yun-qing1, LIU Yu-hui1, SUN Hao2, WANG Hai-jian3, QIAN Ao-ran3
Author information +
History +

Abstract

The work aims to manufacture biomass composite packaging boards with biomass ash from sewage sludge combustion, waste paper fiber and waste wood chips through hot pressing to make high-valued use of the solid waste resources. The effects of raw material formula, adhesive type and hot pressing temperature on the structure and properties of composite packaging board were investigated. The results showed that epoxy resin was the best adhesive. When the mass ratio of paper fiber, biomass ash, waste wood chips and epoxy resin was 40∶30∶20∶10, the bending strength and compressive strength of the composite board prepared by hot pressing process at 4 MPa, 180 ℃ for 20 min were 11.20 MPa and 12.79 MPa, respectively, meeting the requirements of GB/T 7284-2016 Frame Wooden Box". SEM images showed that the biomass ash particles were uniformly attached to the fibers, and the fibers were distributed in a network on the surface of the biomass composite board. It had better thermal stability than ordinary wood. The biomass composite board prepared by adding 30 g biomass ash meets the requirements of national standards and can be used in packaging. This study can not only alleviate the shortage of wood, but also provide a new research idea for the reuse of waste resources and the resource disposal of biomass ash.

Cite this article

Download Citations
FAN Lv-hui, WEI Ling-jun, SHI Yun-qing, LIU Yu-hui, SUN Hao, WANG Hai-jian, QIAN Ao-ran. Preparation and Performance of Biomass Composite Packaging Board[J]. Packaging Engineering. 2022(21): 69-77 https://doi.org/10.19554/j.cnki.1001-3563.2022.21.009
PDF(2119 KB)

Accesses

Citation

Detail

Sections
Recommended

/