Cushioning Performance of Kelvin Structure Based on TPU Material

YU Min, ZHOU Bin, ZHENG Yin-huan

Packaging Engineering ›› 2022 ›› Issue (17) : 82-92.

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PDF(4923 KB)
Packaging Engineering ›› 2022 ›› Issue (17) : 82-92. DOI: 10.19554/j.cnki.1001-3563.2022.17.011

Cushioning Performance of Kelvin Structure Based on TPU Material

  • YU Min, ZHOU Bin, ZHENG Yin-huan
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Abstract

The work aims to explore the cushioning performance of Kelvin structure based on TPU material and provide a new solution for packaging cushioning and vibration reduction. Kelvin structures and regular hexagonal structures of different sizes and specifications were designed, 3D printing was adopted to complete the solid molding and mechanical compression test was carried out for comparative analysis. Kelvin structure based on TPU material had better compression resilience. With the continuous increase of relative density and size grade, the maximum stress increased correspondingly. In case of medium size specifications, the mechanical properties were the best. In case of absorbing the same energy, the stress of the Kelvin structure based on TPU material was less than that of the regular hexagonal structure. Kelvin structure based on TPU material has better mechanical properties and a certain degree of engineering adaptability.

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YU Min, ZHOU Bin, ZHENG Yin-huan. Cushioning Performance of Kelvin Structure Based on TPU Material[J]. Packaging Engineering. 2022(17): 82-92 https://doi.org/10.19554/j.cnki.1001-3563.2022.17.011
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